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Prof. John G. Dillard
Professor
E-mail: john.dillard@vt.edu
Office: 406A Davidson Hall
Phone: 540-231-6926
Fax: 540-231-3255

Education

B.S. - Chemistry, Austin College, Sherman, TX
Ph.D. - Chemistry, Kansas State University, Manhattan, KS

Course Links

Chemistry 5654: http://www.chem.vt.edu/chem-dept/dillard/5654/Main5654.htm
Chemistry 1036: http://www.chem.vt.edu/chem-dept/dillard/1036Class/Main1036.htm

Research Interests

Research interests are in the general area of inorganic surface chemistry. Current research projects focus on adhesive bonding of polymeric materials and metals. Research accomplishments in the area of adhesion have resulted in obtaining an understanding the role of surface treatment on bond failure in durability studies of adhesively bonded polymer-polymer, polymer-metal, and metal-metal systems. Fundamental studies of the acid-base interactions at the adhesive-adherend interface in durability experiments have resulted in a better understanding of the failure processes.

Selected Publications

  1. R. A. DiFelice, J. G. Dillard and D. Yang, Chemical and Nanomechanical Properties of Plasma-Polymerized Acetylene Coatings on Titanium and Silicon, Intl J. Adhesion and Adhesives, (accepted 2004).
  2. R. A. DiFelice, J. G. Dillard and D. Yang, An Investigation of the Properties of Plasma-Polymerized Titanium(IV) Isobutoxide Films, Intl. J. Adhesion and Adhesives, (accepted 2004).
  3. D. Xu, K-T. Wan, J. G. Dillard, C. V. Scott, and D. A. Dillard, Adhesion of a Thin Epoxy Film Bonded to Modified Silicon Substrates as Evaluated Using a Probe Test, Proceedings of the 26th Annual Meeting of the Adhesion Society, Myrtle Beach, SC, February 2003, pp 420-432.
  4. S. Xu, D. A. Dillard and J. G. Dillard, Environmental Aging Effects on the Durability of Electrically Conductive Adhesive Joints, Int. J. Adhesion & Adhesives, 2003, 23, 235-250.
  5. D.A. Dillard, C. Scott, K. Mont, D. Xu, K-T. Wan, R. West and J. G. Dillard, Experimental Evaluation of the Probe Test for Measuring Thin Film Adhesion, Proceedings of ASME International Engineering Congress, 2003, 1-6.


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